The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Aug. 03, 2022
Hitachi High-tech Corporation, Tokyo, JP;
HITACHI HIGH-TECH CORPORATION, Tokyo, JP;
Abstract
An object of the invention is to provide a wafer processing method capable of preventing a positional deviation of a wafer in wafer processing. The wafer processing method according to the invention includes: in a processing apparatus including a sample stage including an electrode configured to electrostatically adsorb a wafer, a waferless electricity-removal step of removing an electric charge charged on the sample stage without placing a wafer on the sample stage; and a wafer processing step of electrostatically adsorbing the wafer placed on the sample stage and processing the wafer after the waferless electricity-removal step. The waferless electricity-removal step includes: a plasma generation step of generating a plasma by using a first electricity-removal gas; and a power supplying step of supplying first power to the electrode of the sample stage.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile