The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

Mar. 04, 2022
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Qi Qi, Beijing, CN;

Ke Wang, Beijing, CN;

Yutao Hao, Beijing, CN;

Jianguo Wang, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H10H 20/857 (2025.01); H10W 90/00 (2026.01); H10W 72/20 (2026.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H10W 90/00 (2026.01); H10W 72/242 (2026.01); H10W 90/724 (2026.01);
Abstract

A light emitting module, a method of manufacturing the light emitting module, and a display device are provided. The light emitting module includes: a back frame; a first substrate; an electronic element array disposed on the first substrate, wherein the electronic element array includes a plurality of electronic elements; an encapsulation layer disposed on the first substrate and covering the electronic element array; and a bonding portion disposed between the back frame and the first substrate, wherein the bonding portion includes a first surface facing the back frame and a second surface facing the first substrate, and the first surface and the second surface are oppositely disposed, wherein a material of the first substrate is an organic material, the back frame is in direct contact with the first surface of the bonding portion, and the first substrate is in direct contact with the second surface of the bonding portion.


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