The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

Sep. 26, 2023
Applicants:

Japan Display Inc., Tokyo, JP;

Idemitsu Kosan Co., Ltd., Tokyo, JP;

Inventors:

Hajime Watakabe, Tokyo, JP;

Masashi Tsubuku, Tokyo, JP;

Toshinari Sasaki, Tokyo, JP;

Takaya Tamaru, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 99/00 (2025.01); H01L 21/02 (2006.01); H10D 30/67 (2025.01); H10P 14/20 (2026.01);
U.S. Cl.
CPC ...
H10D 99/00 (2025.01); H10D 30/6755 (2025.01); H10P 14/3802 (2026.01);
Abstract

A method for manufacturing a semiconductor device includes depositing a first metal oxide film with aluminum as a major component on a substrate, depositing an amorphous oxide semiconductor film on the first metal oxide film under an oxygen partial pressure of 3% to 5%, processing the oxide semiconductor film into a patterned oxide semiconductor layer, crystallizing the oxide semiconductor layer by performing a first heat treatment on the patterned oxide semiconductor layer, processing the first metal oxide film using the crystallized oxide semiconductor layer as a mask, depositing a gate insulating film on the oxide semiconductor layer, and forming a gate electrode on the gate insulating film, wherein a thickness of the oxide semiconductor film is more than 10 nm and 30 nm or less.


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