The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Oct. 13, 2021
Applicant:
Samtec, Inc., New Albany, IN (US);
Inventor:
Eric Zbinden, Santa Clara, CA (US);
Assignee:
SAMTEC, INC., New Albany, IN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/639 (2006.01); G02B 6/42 (2006.01); H01R 43/26 (2006.01);
U.S. Cl.
CPC ...
H01R 13/639 (2013.01); G02B 6/4284 (2013.01); H01R 43/26 (2013.01);
Abstract
A vertical interconnect module and mating receptacle are described. The vertical interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The vertical interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.
Zbinden, Eric. (2026). Vertical interconnect system for high-speed data transmission (U.S. Patent No. 12646889). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12646889
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile