The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Oct. 11, 2022
Hitachi High-tech Corporation, Tokyo, JP;
Makoto Satake, Tokyo, JP;
Takashi Shiota, Tokyo, JP;
Taku Iwase, Tokyo, JP;
Yasushi Sonoda, Tokyo, JP;
Michikazu Morimoto, Tokyo, JP;
HITACHI HIGH-TECH CORPORATION, Tokyo, JP;
Abstract
The invention provides a plasma processing method capable of constructing a self-limited process excellent in mass productivity in a cycle etching method in which an adsorption step of forming a reaction layer on a surface of an etching target wafer and a desorption step of removing the formed reaction layer using a rare gas in a metastable state are repeated. The plasma processing method includes: an adsorption step of forming a reaction layer on an etching target film by plasma generated using a reactive gas; and a desorption step of removing the reaction layer using the rare gas in the metastable state generated by the plasma. The adsorption step and the desorption step are repeated, and a pressure of the adsorption step is higher than a pressure of the desorption step.