The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Apr. 06, 2023
Applicant:
Lx Semicon Co., Ltd., Daejeon, KR;
Inventors:
Yong Sung Ahn, Daejeon, KR;
Hyo Joong Kim, Daejeon, KR;
Kyu Tae Lee, Daejeon, KR;
Hyun Soo Lee, Daejeon, KR;
Jun Seong Im, Dajeon, KR;
Assignee:
LX SEMICON CO., LTD., Daejeon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 19/00 (2006.01); G09G 3/20 (2006.01); H10W 70/65 (2026.01); H10W 72/20 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
G11C 19/00 (2013.01); G09G 3/20 (2013.01); H10W 70/65 (2026.01); G09G 2310/027 (2013.01); G09G 2310/0286 (2013.01); G09G 2310/0291 (2013.01); H10W 72/248 (2026.01); H10W 90/724 (2026.01);
Abstract
A chip-on-film package includes plurality of bumps may be arranged on an integrated circuit, and a plurality of metallic lines are connected to the bumps, thereby transmitting data to a panel, and in a data driving apparatus which may be implemented as the integrated circuit, first bumps and second bumps may be arranged in the same direction in a staggered manner.