The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

May. 19, 2025
Applicant:

Netlist, Inc., Irvine, CA (US);

Inventor:

Hyun Lee, Ladera Ranch, CA (US);

Assignee:

Netlist, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/06 (2006.01); G11C 7/10 (2006.01); G11C 7/12 (2006.01);
U.S. Cl.
CPC ...
G11C 5/066 (2013.01); G11C 5/06 (2013.01); G11C 7/1057 (2013.01); G11C 7/1084 (2013.01); G11C 7/12 (2013.01);
Abstract

A DRAM packages comprises stacked DRAM dies including first DRAM dies and second DRAM dies, first C/A interconnects and first data interconnects configured to conduct C/A signals and data signals to/from the first DRAM dies but not to/from any of the second DRAM dies, and second C/A interconnects and second data interconnects configured to conduct C/A signals and data signals to/from the second DRAM dies but not to/from any of the first DRAM dies. The DRAM package further comprises first drivers and second drivers. The first drivers are configurable to drive data signals to the first DRAM dies via the first data interconnects concurrently with the second drivers driving data signals to the second plurality of DRAM dies via the second data interconnects. Each of the first drivers has a drive strength different from that of any of the second drivers.


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