The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Feb. 14, 2022
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Mitsubishi Heavy Industries Machinery Systems, Ltd., Hyogo, JP;
Takayuki Koyama, Tokyo, JP;
Kiyoka Takagi, Tokyo, JP;
Katsuya Sennyu, Hyogo, JP;
Yoshinao Takakuwa, Hyogo, JP;
Takayuki Miyake, Hyogo, JP;
Katsuhide Aikawa, Hyogo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD., Hyogo, JP;
Abstract
A panel structure manufacturing device includes a shaping device that shapes the surface of a thermoplastic resin into a relief shape and forms a plate-like core member; a heating device that selectively heats the surface of the core member; and a pressurizing device that pressurizes a heated spot of the core member that the heating device has heated and a plate-like face plate, and fuses together the core member and the face plate.