The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

Nov. 21, 2019
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Pierre Bieber, Korschenbroich, DE;

Niklas Matzeit, Bergheim, DE;

Petra Stegmaier, Duesseldorf, DE;

Doreen Eckhardt, Dormagen, DE;

Robert D. Waid, Maplewood, MN (US);

Eike Klünker, Kaarst, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/38 (2018.01); B29C 48/18 (2019.01); C09J 7/35 (2018.01); C09J 11/08 (2006.01); C09J 123/12 (2006.01); C09J 153/02 (2006.01); C09J 165/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/387 (2018.01); B29C 48/18 (2019.02); C09J 7/35 (2018.01); C09J 11/08 (2013.01); C09J 123/12 (2013.01); C09J 153/02 (2013.01); C09J 165/00 (2013.01); C09J 2301/208 (2020.08); C09J 2301/302 (2020.08); C09J 2301/304 (2020.08); C09J 2301/412 (2020.08); C09J 2301/414 (2020.08);
Abstract

The present disclosure relates to a co-extruded multilayer adhesive assembly comprising: a) a heat-activatable adhesive resin layer comprising a (co)polymer of one or more monomers selected from the group consisting of olefins; and b) a pressure sensitive adhesive polymeric foam layer comprising a rubber-based elastomeric material; wherein the heat-activatable adhesive resin layer is in direct contact with the pressure sensitive adhesive foam layer, and wherein the surface of the heat-activatable adhesive resin layer which is in direct contact with the pressure sensitive adhesive foam layer and the surface of the pressure sensitive adhesive foam layer which is indirect contact with the heat-activatable adhesive resin layer are free of any chemical or physical adhesion-promoting surface treatment. The present disclosure also relates to a method of manufacturing such a co-extruded multilayer adhesive assembly and uses thereof.


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