The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
May. 13, 2021
Applicant:
Dic Corporation, Tokyo, JP;
Inventors:
Assignee:
DIC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 61/02 (2006.01); C08G 61/10 (2006.01); C08L 65/02 (2006.01); C08L 65/04 (2006.01);
U.S. Cl.
CPC ...
C08G 61/025 (2013.01); C08G 61/10 (2013.01); C08L 65/02 (2013.01); C08L 65/04 (2013.01); C08G 2261/126 (2013.01); C08G 2261/1646 (2013.01); C08G 2261/312 (2013.01); C08G 2261/592 (2013.01); C08G 2261/76 (2013.01); C08L 2201/08 (2013.01); C08L 2203/162 (2013.01); C08L 2203/206 (2013.01);
Abstract
An object is to provide a cured product having excellent heat resistance and dielectric properties (low dielectric properties) and prepregs, circuit boards, build-up films, semiconductor sealing materials, and semiconductor devices having these pieces of performance by using a curable resin having a specific structure. Specifically, provided is a curable resin having a structural unit (1) represented by General Formula (1) below and a terminal structure (2) represented by General Formula (2) below. In Formulae (1) and (2) above, the details of R, R, R, k, and X are as described herein.