logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12643147 B1

PDFFull Text
Date of Patent:
Jun. 02, 2026

Filed:

Mar. 28, 2022

Joint structure

Applicant:

Mitsui Kinzoku Company, Limited, Tokyo, JP;

Inventors:

Shinichi Yamauchi, Ageo, JP;

Kei Anai, Ageo, JP;

Assignee:

MITSUI KINZOKU COMPANY, LIMITED, , JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

John Vincent Lawler

Int. Cl.
CPC ...
B22F 7/06 (2006.01); B22F 1/052 (2022.01); B22F 1/054 (2022.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01); B22F 3/14 (2006.01); B22F 7/08 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 15/20 (2006.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 72/90 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
B22F 7/064 (2013.01); B22F 1/052 (2022.01); B22F 1/056 (2022.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01); B22F 3/14 (2013.01); B22F 7/08 (2013.01); B32B 7/12 (2013.01); B32B 9/041 (2013.01); B32B 15/20 (2013.01); B22F 2201/02 (2013.01); B22F 2301/10 (2013.01); B22F 2304/056 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B32B 2250/02 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2307/748 (2013.01); H10W 72/07331 (2026.01); H10W 72/352 (2026.01); H10W 72/952 (2026.01); H10W 90/731 (2026.01);
Abstract

A bonded structure is a structure in which two bonding target members and a bonding portion formed between and adjacent to the bonding target members are bonded together. The bonding portion is made of a material mainly containing copper. In a cross section of the bonded structure taken along a thickness direction, a ratio of a bonded rate between the bonding target members and the bonding portion in a peripheral region of the bonded structure to a bonded rate between the bonding target members and the bonding portion in a central region of the bonded structure is from 0.6 to 0.9. The bonded rate is 0.3 or more.

Find Patent Forward Citations

Yamauchi, Shinichi. (2026). Joint structure (U.S. Patent No. 12643147). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12643147

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…