The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

May. 04, 2020
Applicant:

Biosense Webster (Israel) Ltd., Yokneam, IL;

Inventors:

Christopher Thomas Beeckler, Brea, CA (US);

Joseph Thomas Keyes, Sierra Madre, CA (US);

Assaf Govari, Haifa, IL;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A61B 18/14 (2006.01); A61B 5/00 (2006.01); A61B 5/283 (2021.01); A61B 5/287 (2021.01); G03F 7/16 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); A61B 17/00 (2006.01); A61B 18/00 (2006.01);
U.S. Cl.
CPC ...
A61B 18/1492 (2013.01); A61B 5/283 (2021.01); A61B 5/287 (2021.01); A61B 5/6853 (2013.01); A61B 5/6857 (2013.01); G03F 7/16 (2013.01); H05K 3/4038 (2013.01); H05K 3/4644 (2013.01); A61B 2017/00526 (2013.01); A61B 2018/00029 (2013.01); A61B 2018/00083 (2013.01); A61B 2018/0016 (2013.01); A61B 2018/0022 (2013.01); A61B 2018/00375 (2013.01); A61B 2018/00577 (2013.01); A61B 2018/00642 (2013.01); A61B 2018/00702 (2013.01); A61B 2018/00791 (2013.01); A61B 2018/00821 (2013.01); A61B 2018/00839 (2013.01); A61B 2018/00892 (2013.01); A61B 2018/1405 (2013.01); A61B 2018/1465 (2013.01); A61B 2018/1497 (2013.01); A61B 2218/002 (2013.01); A61B 2562/125 (2013.01); A61B 2562/164 (2013.01);
Abstract

A method of constructing an electrophysiology catheter having a flex circuit electrode assembly includes: providing a flex circuit having a substrate, a first conductive layer and a second conductive layer; removing the first conductive layer to expose a first surface of the substrate; forming the wiring electrode in the second conductive layer with one exclusion zone; forming a first through-hole in the substrate to provide one conductive via and forming a second through-hole to provide an irrigation aperture in alignment with the exclusion zone; forming the contact electrode on first surface of the substrate; placing conductive material into the first through-hole to form the conductive via, the conductive via extending through the substrate and electrically coupling the wiring electrode and the contact electrode; and coupling a first conductor and a second conductor to the wiring electrode to form a thermocouple.


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