The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Aug. 03, 2022
Applicant:
Samsung Display Co., Ltd., Yongin-si, KR;
Inventors:
Sangduk Lee, Yongin-si, KR;
Chan-Jae Park, Suwon-si, KR;
Assignee:
SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/10 (2006.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 74/15 (2026.01); H10W 99/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); B23K 20/10 (2013.01); B23K 20/106 (2013.01); H10W 72/07131 (2026.01); H10W 72/07141 (2026.01); H10W 72/07233 (2026.01); H10W 72/07236 (2026.01); H10W 72/07333 (2026.01); H10W 72/07338 (2026.01); H10W 74/15 (2026.01); H10W 90/722 (2026.01); H10W 90/732 (2026.01); H10W 99/00 (2026.01);
Abstract
A bonding apparatus includes an ultrasonic oscillator which generates ultrasonic vibration, a stage disposed under the ultrasonic oscillator, and an embossed sheet disposed between the ultrasonic oscillator and the stage. The embossed sheet includes a body and a plurality of protrusions protruding downward from a lower surface of the body which faces the stage.