The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Jun. 20, 2023
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Qun Ye, Singapore, SG;
Stefan Schwab, Singapore, SG;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 74/47 (2026.01); H10W 72/00 (2026.01); H10W 72/50 (2026.01); H10W 72/90 (2026.01); H10W 74/01 (2026.01); H10W 74/40 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 74/473 (2026.01); H10W 74/01 (2026.01); H10W 74/476 (2026.01); H10W 72/07554 (2026.01); H10W 72/5453 (2026.01); H10W 72/884 (2026.01); H10W 72/944 (2026.01); H10W 74/40 (2026.01); H10W 90/734 (2026.01); H10W 90/736 (2026.01); H10W 90/754 (2026.01); H10W 90/756 (2026.01);
Abstract
A semiconductor package encapsulant is enclosed. In one example, the semiconductor package encapsulant is for at least partially encapsulating a semiconductor component, wherein the semiconductor package encapsulant comprises metal activated inorganic filler particles providing a corrosion protection function.
Ye, Qun. (2026). Semiconductor package encapsulant with metal activated inorganic filler particles (U.S. Patent No. 12642126). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12642126
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile