The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Jul. 24, 2023
Shinko Electric Industries Co., Ltd., Nagano, JP;
Naohiro Mashino, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A semiconductor device includes a first inorganic insulating layer, a metal post embedded in the first inorganic insulating layer, a semiconductor chip mounting part stacked on the first inorganic insulating layer, and a second inorganic insulating layer. The metal post has first and second end faces that are exposed in the first and second opposite surfaces, respectively, of the first inorganic insulating layer. The semiconductor chip mounting part has first and second opposite surfaces and a side surface connecting the first and second opposite surfaces of the semiconductor chip mounting part. The first surface of the semiconductor chip mounting part contacts the second surface of the first inorganic insulating layer. The second inorganic insulating layer covers the entirety of the second surface and the entirety of the side surface of the semiconductor chip mounting part. The second inorganic insulating layer is continuous with the first inorganic insulating layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile