The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Feb. 03, 2021
Applicant:

Schaeffler Technologies Ag & Co. KG, Herzogenaurach, DE;

Inventors:

Bao Ngoc An, Karlsruhe, DE;

Andreas Humbert, Ottersweier, DE;

Jens Kroitzsch, Wissembourg, FR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 70/40 (2026.01); B60R 16/02 (2006.01); H05K 7/20 (2006.01); H10W 40/73 (2026.01);
U.S. Cl.
CPC ...
H10W 40/73 (2026.01); B60R 16/02 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01); H05K 7/20936 (2013.01); H10W 70/461 (2026.01);
Abstract

A power electronics device comprises a power semiconductor, a first circuit board controllingly connected to the power semiconductor, a lead frame connecting the power semiconductor and the first circuit board. The power semiconductor is connected to at least one contacting region of the lead frame in such a way that heat can be transferred from the power semiconductor to the lead frame and can be conducted away from the lead frame by the power semiconductor. The power electronics device further comprises a housing, which borders at least regions of a fluid reservoir accommodating a coolant fluid. The power semiconductor and the lead frame are arranged in the fluid reservoir and are configured to transfer heat to the coolant fluid.


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