The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Oct. 15, 2019
Mitsubishi Electric Corporation, Tokyo, JP;
Yoichi Nogami, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor chip () is provided on an upper surface () of a heat sink (). A lead terminal () is electrically connected to the semiconductor chip (), does not extend above a first side surface () of the heat sink () but extends above a second side surface () of the heat sink (). Mold resin () covers them. A lower surface () of the heat sink () is exposed from the mold resin (). An anchor structure () in which a lower portion of the first side surface () of the heat sink () is recessed and is filled with the mold resin () is provided. The anchor structure () does not exist on the second side surface () of the heat sink (). The heat sink () does not protrude from a side surface () of the mold resin ().