The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12641952 B1

Date of Patent:

May. 26, 2026

Filed:

Jan. 20, 2022

Method for manufacturing display apparatus

Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventors:

Yuichi Yanagisawa, Atsugi, JP;

Shinya Sasagawa, Chigasaki, JP;

Shiro Nishizaki, Kai, JP;

Ryota Hodo, Atsugi, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Attorney:

Fish & Richardson P.C.

Primary Examiner:

Daniel P Shook

Int. Cl.

CPC ...

H10K 59/12 (2023.01); H10K 59/121 (2023.01); H10K 59/35 (2023.01); H10K 59/38 (2023.01);

U.S. Cl.

CPC ...

H10K 59/1201 (2023.02); H10K 59/1213 (2023.02); H10K 59/35 (2023.02); H10K 59/38 (2023.02);

Abstract

A method for manufacturing a display apparatus with high display quality is provided. The method is for manufacturing a display apparatus including first to third insulators, first and second conductors, and a first EL layer. The first conductor is formed over the first insulator, and the second insulator is formed over the first insulator and over the first conductor. Next, a first opening portion reaching the first conductor is formed in a region of the second insulator overlapping with the first conductor. A positive photoresist is applied to regions over the first and second insulators and over the first conductor, and a second opening portion with an inversely tapered structure reaching the first conductor and the second insulator is formed in a region of the photoresist overlapping with the first opening portion and the first conductor. The first EL layer, the second conductor, and the third insulator are sequentially formed on a bottom portion of the second opening portion of the photoresist and over the photoresist, and then, the photoresist and the first EL layer, the second conductor, and the third insulator formed over the photoresist are removed.

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