The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Jan. 15, 2024
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kai Ding, Cupertino, CA (US);

Lisong Xu, San Jose, CA (US);

Mingwei Zhu, San Jose, CA (US);

Zhiyong Li, Foster City, CA (US);

Hou T. Ng, Campbell, CA (US);

Sivapackia Ganapathiappan, Los Altos, CA (US);

Nag Patibandla, Dublin, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/841 (2025.01); H01L 25/16 (2023.01); H10H 20/01 (2025.01); H10H 20/825 (2025.01); H10H 20/856 (2025.01); H10H 29/14 (2025.01); H10H 29/80 (2025.01); H10K 59/12 (2023.01); H10K 59/122 (2023.01); H10K 59/35 (2023.01); H10K 59/80 (2023.01);
U.S. Cl.
CPC ...
H10H 20/841 (2025.01); H01L 25/167 (2013.01); H10H 20/011 (2025.01); H10H 20/032 (2025.01); H10H 20/825 (2025.01); H10H 20/856 (2025.01); H10H 29/142 (2025.01); H10H 29/8421 (2025.01); H10K 59/1201 (2023.02); H10K 59/122 (2023.02); H10K 59/35 (2023.02); H10K 59/878 (2023.02); H10H 20/034 (2025.01);
Abstract

Micro-LED structures include an LED epilayer that may be formed before the micro-LED structure is coupled to a backplane substrate. In order to prevent light leakage and maximize light output, the sidewalls and other surfaces of the LED epilayer may be coated with a reflective coating. For example, the reflective coating may include a metal layer that is electrically insulated between dielectric layers from the micro-LED electrodes. The reflective coating may also be formed using multiple layers in a distributed Bragg reflector configuration. This reflective coating may be formed during the LED fabrication process before the micro-LED structure is coupled to the backplane. The pixel isolation structures on the backplane may also include a reflective coating that is applied above the LED epilayers.


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