The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Apr. 19, 2023
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Takayuki Goto, Foster City, CA (US);

Kazufumi Watanabe, Mountain View, CA (US);

Rui Wang, San Jose, CA (US);

Assignee:

OMNIVISION TECHNOLOGIES, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H10W 72/90 (2026.01); H10W 80/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10F 39/811 (2025.01); H10F 39/809 (2025.01); H10W 72/926 (2026.01); H10W 72/931 (2026.01); H10W 72/932 (2026.01); H10W 72/936 (2026.01); H10W 72/9415 (2026.01); H10W 72/9445 (2026.01); H10W 72/952 (2026.01); H10W 72/957 (2026.01); H10W 80/701 (2026.01); H10W 80/754 (2026.01); H10W 90/792 (2026.01);
Abstract

A stacked semiconductor device comprising a first semiconductor substrate, a second semiconductor substrate, an insulating medium disposed between the first semiconductor substrate and the second semiconductor substrate, a plurality of connection pads including a first connection pad and a second connection pad, a first connection pad shield structure, and a second connection pad shield structure. The plurality of connection pads is disposed within the insulating medium and configured to provide one or more electrical connections extending between the first semiconductor substrate and the second semiconductor substrate. The first connection pad is disposed between the first connection pad shield structure and the second connection pad shield structure.


Find Patent Forward Citations

Goto, Takayuki. (2026). Stacked semiconductor device with connection pad disposed between connection pad shields (U.S. Patent No. 12641905). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12641905

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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