The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Dec. 25, 2020
Applicant:

Sato Holdings Kabushiki Kaisha, Tokyo, JP;

Inventor:

Yoshimitsu Maeda, Tokyo, JP;

Assignee:

SATO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/08 (2006.01); H05K 13/04 (2006.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H05K 13/0812 (2018.08); H05K 13/0409 (2018.08); H05K 13/041 (2018.08); H05K 13/0411 (2018.08); H05K 13/0882 (2018.08); H10P 72/0428 (2026.01);
Abstract

The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and a controller configured to control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.


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