The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Aug. 19, 2022
Applicant:

Kyocera Avx Components Corporation, Fountain Inn, SC (US);

Inventors:

Cory Nelson, Simpsonville, SC (US);

Marianne Berolini, Greer, SC (US);

Assignee:

KYOCERA AVX Components Corporation, Fountain Inn, SC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2026.01); H05K 1/181 (2026.01); H05K 1/184 (2026.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H05K 1/116 (2013.01); H05K 1/0212 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 1/112 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 1/184 (2013.01); H05K 7/2039 (2013.01); H05K 7/205 (2013.01); H05K 2201/066 (2013.01); H05K 2201/09218 (2013.01); H05K 2201/09372 (2013.01); H05K 2201/095 (2013.01);
Abstract

A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. The body can have a top surface, a bottom surface opposite the top surface, and a plurality of side surfaces. The heat sink component also can include a heat source terminal formed over the bottom surface of the body. The heat source terminal can be spaced apart from the plurality of side surfaces. The heat sink component further can include a heat sink terminal formed over the bottom surface of the body. The heat sink terminal can be spaced apart from the plurality of side surfaces.


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