The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Feb. 04, 2024
Applicant:

Innolux Corporation, Miaoli County, TW;

Inventors:

Jen-Hai Chi, Miaoli County, TW;

Shun-Yuan Hu, Miaoli County, TW;

Assignee:

Innolux Corporation, Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/181 (2026.01); H01R 4/02 (2006.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 72/90 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01R 4/02 (2013.01); H05K 2201/10636 (2013.01); H10W 72/07253 (2026.01); H10W 72/07254 (2026.01); H10W 72/234 (2026.01); H10W 72/244 (2026.01); H10W 72/926 (2026.01); H10W 72/932 (2026.01); H10W 72/934 (2026.01); H10W 72/9445 (2026.01); H10W 90/724 (2026.01);
Abstract

An electronic device includes a circuit substrate, an electronic element, and a connection layer. The circuit substrate includes a plurality of first bonding pads. The electronic element includes a plurality of second bonding pads. The connection layer is provided between one of the first bonding pads and one of the second bonding pads. The connection layer includes a first portion, a second portion, and a third portion. The second portion is a portion of the connection layer that overlaps with a projection region of the second bonding pad onto the circuit substrate. The first portion is a portion away from another first bonding pad that does not overlap with the projection region. The third portion is a portion which is adjacent to the another first bonding pad and does not overlap with the projection region. A maximum width of the first portion is different from that of the third portion.


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