The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

May. 27, 2022
Applicants:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Sumitomo Electric Printed Circuits, Inc., Shiga, JP;

Inventors:

Yosuke Fukaya, Osaka, JP;

Koji Nitta, Osaka, JP;

Daisuke Sato, Shiga, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 3/12 (2006.01); H05K 3/42 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H05K 1/0393 (2013.01); H05K 3/1258 (2013.01); H05K 3/423 (2013.01); H05K 3/0017 (2013.01);
Abstract

A flexible printed circuit board according to an embodiment includes a base film and a first wire. The base film has a first surface. The first wire is disposed on the first surface. The first wire has a first layer and a second layer. The first layer is disposed on the first surface directly or indirectly. The second layer covers the first layer. In the first surface, a first groove is formed next to the first layer in a plan view. The second layer on a side surface of the first layer exists on a bottom surface and a side surface of the first groove.


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