The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Oct. 20, 2021
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Jung Eun Han, Seoul, KR;

Se Woong Na, Seoul, KR;

Byeong Tae Im, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 3/4092 (2013.01); H05K 3/429 (2013.01); H05K 2201/09727 (2013.01);
Abstract

A circuit board according to an embodiment includes an insulating layer including first to third regions; an outer circuit pattern disposed on upper surfaces of the first to third regions of the insulating layer, and a solder resist including a first part disposed on the first region of the insulating layer, a second part disposed on the second region, and a third part disposed on the third region, wherein the outer circuit pattern includes a first trace disposed on an upper surface of the first region of the insulating layer; a first pad disposed on an upper surface of the first region of the insulating layer; and a second trace disposed on an upper surface of the third region of the insulating layer; wherein an upper surface of the first part of the solder resist is positioned lower than an upper surface of the first trace; and a height of the first trace is different from a height of the first pad.


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