The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Sep. 01, 2022
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Keiichi Maki, Suita, JP;

Hironori Fukuhara, Ibaraki, JP;

Rei Goto, Osaka, JP;

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/08 (2006.01); H03H 9/02 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 3/08 (2013.01); H03H 9/02818 (2013.01); H03H 9/02834 (2013.01); H03H 9/6483 (2013.01);
Abstract

A method of making a surface acoustic wave package includes bonding a piezoelectric layer over a substrate and attaching a metal structure over the substrate, with the piezoelectric layer positioned between at least a portion of the substrate and at least a portion of the metal structure. The method also includes removing (e.g., etching) an outer boundary of the piezoelectric layer so that a resulting outer edge of the piezoelectric layer is spaced inward of an inner edge of the metal package (e.g., the piezoelectric layer does not contact the metal package). The method inhibit damage to the piezoelectric layer due to a stress differential between the substrate and the thermally conductive structure during a packaging process.


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