The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Jan. 31, 2024
Applicant:

Menlo Microsystems, Inc., Irvine, CA (US);

Inventors:

Sanchien Hong, Placentia, CA (US);

Wei Ye, Westford, MA (US);

Hajime Terazawa, Carlsbad, CA (US);

Assignee:

Menlo Microsystems, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/08 (2013.01); B81B 7/0006 (2013.01); B81C 1/00269 (2013.01); H01P 11/003 (2013.01);
Abstract

A coplanar waveguide (CPW) structure on a micro-electromechanical system (MEMS) device may comprise a glass device substrate that hosts a MEMS component on a first surface of the glass device substrate. The glass device substrate may have an associated set of metal layers that are used for fabrication of the MEMS component. The CPW structure may further comprise a glass cap having a top metal layer and a bottom metal layer. The CPW structure may further comprise a CPW signal path on the first surface of the glass device substrate, and a CPW ground plane on the first surface of the glass device substrate along a side of the CPW signal path. The CPW ground plane may comprise the bottom metal layer of the glass cap and at least one metal layer of the set of metal layers that are used for fabrication of the at least one MEMS component.


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