The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Apr. 01, 2021
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Shinji Hayashi, Tokyo, JP;

Yoichi Mochizuki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/375 (2021.01); H01M 50/186 (2021.01); H01M 50/193 (2021.01); H01M 50/198 (2021.01); H01M 50/342 (2021.01); H01M 50/178 (2021.01);
U.S. Cl.
CPC ...
H01M 50/375 (2021.01); H01M 50/186 (2021.01); H01M 50/193 (2021.01); H01M 50/198 (2021.01); H01M 50/342 (2021.01); H01M 50/178 (2021.01); H01M 2200/10 (2013.01);
Abstract

An adhesive film for a metal terminal, which is to be interposed between a metal terminal electrically connected to an electrode of a power storage device element and a power storage device packaging material for sealing the power storage device element, wherein the adhesive film for a metal terminal has a laminate sequentially including a first polyolefin layer disposed on the metal terminal side, a base material, and a second polyolefin layer disposed on the power storage device packaging material side, at least one of the first polyolefin layer and the second polyolefin layer has a melting peak temperature of 105° C. or more and 130° C. or less, and the base material has a surface hardness of 15 N/mmor more, as measured in an environment at a temperature of 110° C.


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