The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Nov. 17, 2022
Applicant:

Byd Company Limited, Shenzhen, CN;

Inventors:

Huajun Sun, Shenzhen, CN;

Xiaopeng Wang, Shenzhen, CN;

Qingbo Peng, Shenzhen, CN;

Zhipei Lu, Shenzhen, CN;

Yan Zhu, Shenzhen, CN;

Assignee:

BYD Company Limited, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/207 (2021.01); B60L 50/64 (2019.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); H01M 10/6567 (2014.01); H01M 50/112 (2021.01); H01M 50/174 (2021.01); H01M 50/244 (2021.01); H01M 50/249 (2021.01); H01M 50/291 (2021.01); H01M 50/342 (2021.01); H01M 50/474 (2021.01); H01M 50/477 (2021.01); H01M 50/51 (2021.01); H01M 50/512 (2021.01); H01M 50/531 (2021.01); H01M 50/548 (2021.01); H01M 50/588 (2021.01); H01M 50/591 (2021.01);
U.S. Cl.
CPC ...
H01M 50/207 (2021.01); B60L 50/64 (2019.02); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 10/6567 (2015.04); H01M 50/112 (2021.01); H01M 50/174 (2021.01); H01M 50/244 (2021.01); H01M 50/249 (2021.01); H01M 50/291 (2021.01); H01M 50/3425 (2021.01); H01M 50/474 (2021.01); H01M 50/477 (2021.01); H01M 50/51 (2021.01); H01M 50/512 (2021.01); H01M 50/531 (2021.01); H01M 50/548 (2021.01); H01M 50/588 (2021.01); H01M 50/591 (2021.01); H01M 2200/20 (2013.01); H01M 2220/20 (2013.01);
Abstract

A battery pack includes a housing and multiple electrode core strings electrically connected to each other and disposed in the housing. The housing includes a housing body which includes sub-housings connected to each other. A sub-housing includes at least one reinforcing plate and a top plate and a bottom plate oppositely arranged in a first direction. The reinforcing plate is arranged between and is connected to the top plate and the bottom plate, and divides an interior of the corresponding sub-housing into multiple accommodating cavities. At least one accommodating cavity includes at least one electrode core string which includes electrode core assemblies connected and arranged in a second direction. The electrode core assemblies are disposed in an encapsulation film. A length of the electrode core string extends in the second direction. The housing includes a mounting component that is configured to be connected and fixed to an external load.


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