The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Oct. 24, 2023
Applicant:

Quantinuum Llc, Broomfield, CO (US);

Inventors:

Benjamin Norman Spaun, Westminster, CO (US);

Tyler Davis Hilbun, Broomfield, CO (US);

Riley Dewitt Ancona, Westminster, CO (US);

Jason Anthony Fuqua, Dacono, CO (US);

Assignee:

QUANTINUUM LLC, Broomfield, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 49/24 (2006.01); H01J 5/22 (2006.01);
U.S. Cl.
CPC ...
H01J 49/24 (2013.01); H01J 5/22 (2013.01); H01J 2209/264 (2013.01); H01J 2209/267 (2013.01); H01J 2209/268 (2013.01);
Abstract

An ultra-high vacuum seal assembly includes a circuit board, a first ring, and a second ring. The first ring and the second ring include indium. The circuit board includes a first surface and a second surface that is opposite the first surface. The circuit board also includes a via array that is in electrical communication with the first surface and the second surface of the circuit board. The first ring is positioned directly on the first surface of the circuit board and the second ring is positioned directly on the second surface of the circuit board.


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