The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Sep. 07, 2021
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuuichi Kawaguchi, Tokyo, JP;

Naoaki Fujii, Tokyo, JP;

Tomonaga Nishikawa, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/32 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 27/323 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 2027/2809 (2013.01);
Abstract

To prevent a short-circuit failure by controlling the flow of a solder in a surface-mount type coil component. A coil component includes a coil part in which conductor layers and interlayer insulating layers are alternately stacked. The conductor layers respectively have coil conductor patterns embedded in the coil part and electrode patterns exposed from the coil part. The interlayer insulating layers each protrude from the plurality of electrode patterns at a part between the electrode patterns, and the flow of a solder in the stacking direction is suppressed by the protruding parts. This makes it possible to prevent a short-circuit failure due to the flow of a solder in the stacking direction.


Find Patent Forward Citations

Loading…