The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Sep. 27, 2021
Applicant:
Rockley Photonics Limited, Altrincham, GB;
Inventors:
Ludovic Caro, Cork, IE;
Guomin Yu, Glendora, CA (US);
Assignee:
Rockley Photonics Limited, Altrincham, GB;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/01 (2025.01); B41F 16/00 (2006.01); G02B 6/12 (2006.01); G02B 6/122 (2006.01); G02B 6/132 (2006.01); G02B 6/136 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H01L 21/78 (2006.01); H10D 84/05 (2025.01); H10P 72/70 (2026.01); H10P 95/00 (2026.01); H10W 72/00 (2026.01); H10W 74/01 (2026.01);
U.S. Cl.
CPC ...
G02B 6/136 (2013.01); B41F 16/0046 (2013.01); G02B 6/12 (2013.01); G02B 6/122 (2013.01); G02B 6/132 (2013.01); G02B 6/4207 (2013.01); G02B 6/43 (2013.01); H10D 84/05 (2025.01); H10P 72/74 (2026.01); H10P 95/112 (2026.01); H10W 72/0198 (2026.01); H10W 74/014 (2026.01); H10P 72/7428 (2026.01);
Abstract
A coupon wafer for a micro-transfer printing process. The coupon wafer including a device coupon attached to a substrate of the coupon wafer by one or more tethers; wherein the or each tether is a pillar extending at least partially through the device coupon to contact the substrate of the coupon wafer.