The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Feb. 02, 2024
Applicant:

California Institute of Technology, Pasadena, CA (US);

Inventors:

Saransh Sharma, Pasadena, CA (US);

Azita Emami, Pasadena, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 33/02 (2006.01); A61B 5/06 (2006.01); G01R 33/028 (2006.01);
U.S. Cl.
CPC ...
G01R 33/0286 (2013.01); A61B 5/062 (2013.01); G01R 33/0206 (2013.01);
Abstract

An on-chip electrical coil includes a semiconductor substrate; a plurality of metal layers disposed on the semiconductor substrate; a plurality of insulator layers disposed on the semiconductor substrate, each insulator layer disposed between a pair of neighboring metal layers to form an alternating arrangement of metal layers and insulator layers; a plurality of metal vias defined in the insulator layers, each metal via electrically connecting a respective pair of neighboring metal layers; and a planar spiral formed by the metal layers and the metal vias, the planar spiral including a plurality of interconnected loops, each loop including two metal wires disposed in respective metal layers, an intra-loop column that electrically connects the two metal wires of a respective loop, and an inter-loop column that electrically connects one of the metal wires of the respective loop to one of the metal wires in a subsequent loop.


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