The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Feb. 08, 2023
Applicant:

Ajou University Industry-academic Cooperation Foundation, Suwon-si, KR;

Inventors:

Jaehyun Lee, Bucheon-si, KR;

Jiyun Moon, Yongin-si, KR;

Jun-Hui Choi, Suwon-si, KR;

Seung-Il Kim, Suwon-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); C23C 16/34 (2006.01); G01N 21/65 (2006.01);
U.S. Cl.
CPC ...
G01N 21/658 (2013.01); C23C 16/342 (2013.01);
Abstract

The present disclosure relates to a method for analyzing a grain boundary of a polycrystalline two-dimensional material including transferring a polycrystalline two-dimensional material onto a substrate for analysis including a single crystalline two-dimensional material formed on a substrate; analyzing the polycrystalline two-dimensional material; depositing a metal thin film on the polycrystalline two-dimensional material; and exfoliating the polycrystalline two-dimensional material.


Find Patent Forward Citations

Lee, Jaehyun. (2026). Method for grain boundary analysis of polycrystalline two-dimensional materials (U.S. Patent No. 12638398). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12638398

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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