The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Nov. 14, 2023
Applicant:
Tokai Carbon Co., Ltd., Tokyo, JP;
Inventors:
Mayuri Imagawa, Tokyo, JP;
Shohei Oishi, Tokyo, JP;
Akihiro Kuroyanagi, Tokyo, JP;
Reiko Yashikida, Tokyo, JP;
Assignee:
TOKAI CARBON CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/32 (2006.01); C23C 16/52 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
C23C 16/325 (2013.01); C23C 16/52 (2013.01); C23C 16/56 (2013.01);
Abstract
An object of the present disclosure is to provide a SiC formed body having low resistance and a method for producing the SiC formed body. The present disclosure provides a SiC formed body wherein a volume resistivity thereof is 7.0×10Ω·cm or less, and a nitrogen concentration thereof is in a range exceeding 1000 ppm and up to 4500 ppm.
Imagawa, Mayuri. (2026). Sic formed body and method for producing sic formed body (U.S. Patent No. 12637762). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12637762
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile