The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Jan. 13, 2022
Applicant:

Wacker Chemie Ag, Munich, DE;

Inventor:

Sebastian Knör, Emmerting, DE;

Assignee:

Wacker Chemie AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08K 3/02 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08K 3/02 (2013.01); C08K 2003/023 (2013.01); C08K 2201/001 (2013.01);
Abstract

Crosslinkable heat-conducting silicone compositions (Y), methods for manufacturing and using the same. Where the compositions (Y) include 5-50% by volume of a crosslinkable silicone composition (S) and 50-95% by volume of at least one thermally conductive filler (Z) having a thermal conductivity of at least 5 W/mK. The compositions (Y) have a thermal conductivity of at least 0.6 W/mK and at least 20% by volume of metallic silicon particles present as thermally conductive fillers (Z) fulfil the following features: (a) the fillers (Z) have a median diameter x50 in the range of 30-150 μm, (b) the fillers (Z) are predominately rounded, and have a width/length ratio (aspect ratio w/l) that is at least 0.76, (c) the fillers (Z) have a distribution range SPAN ((x90−x10)/x50) that is at least 0.40, and (d) the fillers (Z) contain at most 1.5% by weight of silicon particles that are smaller than 2 μm.


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