The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Mar. 26, 2021
Dow Toray Co., Ltd., Tokyo, JP;
Ryosuke Yamazaki, Ichihara, JP;
Shinichi Yamamoto, Ichihara, JP;
Kouichi Ozaki, Ichihara, JP;
Toru Imaizumi, Ichihara, JP;
DOW TORAY CO., LTD., Tokyo, JP;
Abstract
Provided is a hot-melt curable silicone composition that forms a cured product that can be cured at a temperature of 100° C. or lower, has excellent storage stability, is relatively hard from curing, and has low surface tack, and a sheet or film formed from the same. The curable silicone composition comprises: (A) a solid organopolysiloxane resin that contains at a mass ratio of 0:100 to 90:10 (Al) an organopolysiloxane resin having a curing reactive functional group and containing 20 mol % or more of a Q unit (i.e., a SiOunit), and (A2) an organopolysiloxane resin not having a curing reactive functional group and containing 20 mol % or more of a Q unit; (B) 10 to 100 parts by mass of a straight-chain or branched organopolysiloxane having a curing reactive functional group and is liquid or has plasticity; (C) an organohydrogenpolysiloxane; and (D) a photoactivated hydrosilylation reaction catalyst.