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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12637565 B1

PDFFull Text
Date of Patent:
May. 26, 2026

Filed:

Nov. 25, 2020

Resin composition, layered body including resin composition layer, layered body, flexible copper-clad laminate, flexible flat cable, and electromagnetic wave shielding film

Applicant:

Toagosei Co., Ltd., Tokyo, JP;

Inventors:

Masahiro Torii, Nagoya, JP;

Yuya Okimura, Nagoya, JP;

Hironori Kutsuna, Nagoya, JP;

Makoto Hirakawa, Nagoya, JP;

Masashi Yamada, Nagoya, JP;

Assignee:

TOAGOSEI CO., LTD., Tokyo, JP;

Attorney:

Dority & Manning, PA

Primary Examiner:

K Boyle

Int. Cl.
CPC ...
C08L 75/06 (2006.01); B32B 15/092 (2006.01); B32B 15/095 (2006.01); B32B 15/20 (2006.01); C08L 63/04 (2006.01);
U.S. Cl.
CPC ...
C08L 75/06 (2013.01); B32B 15/092 (2013.01); B32B 15/095 (2013.01); B32B 15/20 (2013.01); C08L 63/04 (2013.01); B32B 2311/12 (2013.01); B32B 2363/00 (2013.01); B32B 2375/00 (2013.01); B32B 2457/08 (2013.01); C08L 2203/16 (2013.01); C08L 2203/202 (2013.01);
Abstract

A resin composition including a polyester polyurethane resin (A); and an epoxy resin (B), in which a molecular weight per a urethane bond of the polyester polyurethane resin (A) is from 200 to 8,000, and a layered body including a resin composition layer, a layered body, a flexible copper-clad laminate, a flexible flat cable, or an electromagnetic wave shielding film, each using the resin composition.

Find Patent Forward Citations

Torii, Masahiro. (2026). Resin composition, layered body including resin composition layer, layered body, flexible copper-clad laminate, flexible flat cable, and electromagnetic wave shielding film (U.S. Patent No. 12637565). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12637565

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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