The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Mar. 21, 2023
Applicants:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Dupont Electronics, Inc., Wilmington, DE (US);

Inventors:

Colin Hayes, Hudson, MA (US);

Anton Chavez, West Newton, MA (US);

Nora Sabina Radu, Ladenberg, PA (US);

Jaclyn Murphy, Ashland, MA (US);

Qing Min Wang, North Andover, MA (US);

Tao Huang, Stow, MA (US);

Anton Li, Marlborough, MA (US);

Tanya N. Singh-Rachford, South Grafton, MA (US);

Michael Gallagher, Hopkinton, MA (US);

Assignees:

Dupont Electronic Materials International, LLC, Marlborough, MA (US);

DuPont Electronics, Inc., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/20 (2025.01); C08K 5/5399 (2006.01); C08L 77/10 (2006.01); C08L 79/08 (2006.01);
U.S. Cl.
CPC ...
C08L 23/20 (2013.01); C08K 5/5399 (2013.01); C08L 77/10 (2013.01); C08L 79/08 (2013.01); C08L 2203/16 (2013.01);
Abstract

There is provided a resin composition from a mixture including: (a) 30-80 weight % of at least one thermosetting resin; and (b) 20-70 weight % of at least one soluble polyimide resin. The resin composition can be used in electronics applications.


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