The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Oct. 27, 2021
Toray Industries, Inc., Tokyo, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
An epoxy resin composition is provided that is resistant to decomposition at high temperatures and a fiber-reinforced resin molding is provided that hardly suffers significant damage while being welded to another member even in the case where it is combined with a thermoplastic resin layer having a high melting point that works as an adhesive layer, as well as a prepreg that serves as a precursor therefor, where the epoxy resin composition includes an epoxy resin (A) that has a polycyclic aromatic hydrocarbon skeleton or a biphenyl skeleton and that has an epoxy equivalent weight of 220 g/eq or more and 290 g/eq or less and a polyamine compound having an average active hydrogen equivalent weight of 55 g/eq or more and 100 g/eq or less wherein the average epoxy equivalent weight over all epoxy resins contained is 160 g/eq or more and 255 g/eq or less.