The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Mar. 02, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Itai Lieberman, Oud-Heverlee, BE;
Manuel Hamburger, Mannheim, DE;
Christian Matuschek, Frankfurt am Main, DE;
Thomas Eberle, Landau, DE;
Beate Burkhart, Darmstadt, DE;
Sebastian Meyer, Frankfurt am Main, DE;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07F 9/38 (2006.01); B82Y 20/00 (2011.01); B82Y 40/00 (2011.01); C01B 19/00 (2006.01); C07C 323/22 (2006.01); C07D 251/24 (2006.01); H10K 50/11 (2023.01); H10K 50/115 (2023.01); H10K 50/12 (2023.01); H10K 85/60 (2023.01);
U.S. Cl.
CPC ...
C07F 9/3882 (2013.01); C01B 19/007 (2013.01); C07C 323/22 (2013.01); C07D 251/24 (2013.01); H10K 50/11 (2023.02); H10K 85/633 (2023.02); H10K 85/654 (2023.02); B82Y 20/00 (2013.01); B82Y 40/00 (2013.01); H10K 50/115 (2023.02); H10K 50/121 (2023.02);
Abstract
The present invention relates to a compound suitable as ligand for binding to the surface of a semiconductor nanoparticle, said compound comprising an anchor group, a linker group and an organic functional group; a semiconductor nanoparticle have said ligand attached to the outermost particle surface; a composition, a formulation and a process for the preparation of said semiconductor nanoparticle; and an electronic device.