The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Feb. 22, 2022
Tokuyama Corporation, Shunan, JP;
Tomoyuki Kakigi, Shunan, JP;
Shota Daiki, Shunan, JP;
Tokuyama Corporation, Shunan, JP;
Abstract
Provided is a hexagonal boron nitride powder capable of obtaining a resin composition excellent in solder heat resistance. The solder heat resistance of the resin composition can be improved by using a hexagonal boron nitride powder having a ratio (S/S) of a BET specific surface area (S) measured using water as an adsorbed species to a BET specific surface area (S) measured using nitrogen as an adsorbed species of 0.07 or less. In addition, by a method for producing a hexagonal boron nitride powder, including a step of heat-treating a coarse hexagonal boron nitride powder having an amount of eluted boron of 60 ppm or less at 1300° C. or higher and 2200° C. or lower in a nitrogen atmosphere having a dew point temperature of −85° C. or lower, a hexagonal boron nitride powder capable of improving the solder heat resistance of the resin composition can be obtained.