The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

May. 17, 2024
Applicant:

Lawrence Livermore National Security, Llc, Livermore, CA (US);

Inventors:

Bassem S. El-Dasher, Livermore, CA (US);

Andrew J. Bayramian, Marblehead, MA (US);

James A. Demuth, Woburn, MA (US);

Joseph C. Farmer, Tracy, CA (US);

Sharon G. Torres, Livermore, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/153 (2017.01); B22F 10/20 (2021.01); B22F 10/28 (2021.01); B22F 10/36 (2021.01); B22F 12/43 (2021.01); B22F 12/44 (2021.01); B23K 26/042 (2014.01); B23K 26/0622 (2014.01); B23K 26/064 (2014.01); B23K 26/066 (2014.01); B23K 26/144 (2014.01); B23K 26/342 (2014.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B22F 10/30 (2021.01); B22F 12/55 (2021.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B29C 64/153 (2017.08); B22F 10/20 (2021.01); B22F 10/28 (2021.01); B22F 10/36 (2021.01); B22F 12/43 (2021.01); B22F 12/44 (2021.01); B23K 26/042 (2015.10); B23K 26/0622 (2015.10); B23K 26/0643 (2013.01); B23K 26/066 (2015.10); B23K 26/144 (2015.10); B23K 26/342 (2015.10); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12); B22F 10/30 (2021.01); B22F 12/55 (2021.01); B33Y 50/02 (2014.12); Y02P 10/25 (2015.11);
Abstract

The present disclosure relates to a system for performing an Additive Manufacturing (AM) fabrication process on a powdered material, deposited as a powder bed and forming a substrate. The system makes use of a laser for generating a laser beam, and an optical subsystem. The optical subsystem is configured to receive the laser beam and to generate an optical signal comprised of electromagnetic radiation sufficient to melt or sinter the powdered material. The optical subsystem uses a digitally controlled mask configured to pattern the optical signal as needed to melt select portions of a layer of the powdered material to form a layer of a 3D part. A power supply and at least one processor are also included for generating a plurality of different power density levels selectable based on a specific material composition and a known absorptivity of the powder particles. The powdered material is used to form the 3D part in a sequential layer-by-layer additive manufacturing process.


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