The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Aug. 31, 2022
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Kazuo Watabe, Yokohama Kanagawa, JP;

Keisuke Ueno, Kawasaki Kanagawa, JP;

Hidefumi Takamine, Tokyo, JP;

Yongfang Li, Kawasaki Kanagawa, JP;

Takashi Usui, Saitama Saitama, JP;

Junko Hirokawa, Tokyo, JP;

Yuki Ueda, Yokohama Kanagawa, JP;

Tetsuya Kugimiya, Kawasaki Kanagawa, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B 7/06 (2006.01); B23B 7/12 (2006.01); C09J 5/06 (2006.01);
U.S. Cl.
CPC ...
B23B 7/06 (2013.01); B23B 7/12 (2013.01); C09J 5/06 (2013.01);
Abstract

According to one embodiment, a sensor attachment/detachment device of the embodiment includes a sensor, a bonding member, a support portion, and a release execution portion. The bonding member is bonded to a first surface of the sensor and has a function of decreasing an adhesive force. The support portion can support the sensor by directly contacting a second surface of the sensor or via another functional portion. The release execution portion performs a process of releasing the bonding member from the object by decreasing the adhesive force of the bonding member after the sensor is attached to the object by the bonding member.


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