The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Sep. 06, 2021
Applicant:

Mitsui Kinzoku Company, Limited, Tokyo, JP;

Inventors:

Satoshi Konno, Ageo, JP;

Shinichi Yamauchi, Ageo, JP;

Kei Anai, Ageo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2022.01); B22F 1/052 (2022.01); B22F 1/054 (2022.01); B22F 1/10 (2022.01); B22F 3/10 (2006.01); B22F 7/06 (2006.01); B22F 7/08 (2006.01); B32B 7/12 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/20 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); H01B 1/22 (2006.01); H10W 70/40 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 72/90 (2026.01);
U.S. Cl.
CPC ...
B22F 1/052 (2022.01); B22F 1/056 (2022.01); B22F 1/10 (2022.01); B22F 3/1007 (2013.01); B22F 7/064 (2013.01); B22F 7/08 (2013.01); B32B 7/12 (2013.01); B32B 9/007 (2013.01); B32B 9/04 (2013.01); B32B 15/20 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); H01B 1/22 (2013.01); B22F 2201/02 (2013.01); B22F 2301/10 (2013.01); B22F 2304/05 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B32B 2250/02 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2264/1055 (2020.08); B32B 2264/302 (2020.08); B32B 2307/202 (2013.01); B32B 2457/00 (2013.01); C09J 2400/16 (2013.01); H10W 70/417 (2026.01); H10W 72/073 (2026.01); H10W 72/07331 (2026.01); H10W 72/07341 (2026.01); H10W 72/325 (2026.01); H10W 72/352 (2026.01); H10W 72/353 (2026.01); H10W 72/952 (2026.01);
Abstract

A conductive composition for bonding includes a mix of copper powder carboxylic acid. The carboxylic acid has a branched carbon chain. The copper powder comprises first and second copper particles. The first copper particles have a volume-based cumulative particle size Dof 0.11 μm or more and less than 1 μm at a cumulative volume of 50 vol % in a region of particle sizes of less than 1 μm in a particle size distribution of the copper powder. The second copper particles have a volume-based cumulative particle size Dof 1 μm or more and 10 μm or less at a cumulative volume of 50 vol % in a region of particle sizes of 1 μm or more in the particle size distribution of the copper powder. The carboxylic acid is contained in an amount of 6 parts or more and 24 parts or less per 100 parts by mass.


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