The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Aug. 21, 2024
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Toru Endo, Kyoto, JP;

Takuji Kato, Kyoto, JP;

Rikuta Aoki, Kyoto, JP;

Yuta Yamanouchi, Kyoto, JP;

Yutaka Ikegami, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 12/00 (2006.01); B08B 3/02 (2006.01); B08B 5/02 (2006.01); F26B 11/18 (2006.01); F26B 21/40 (2026.01); F26B 21/50 (2026.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
B08B 3/024 (2013.01); B01D 12/00 (2013.01); B08B 5/02 (2013.01); F26B 11/18 (2013.01); F26B 21/40 (2026.01); F26B 21/50 (2026.01); H10P 72/0404 (2026.01); H10P 72/0406 (2026.01); H10P 72/0408 (2026.01); H10P 72/0414 (2026.01);
Abstract

A rinse liquid remaining on a substrate after a rinsing process is replaced with a replacement liquid having a surface tension lower than that of the rinse liquid. During this replacement, a nozzle device is arranged at a nozzle upper position higher than a processing cup. The nozzle device is moved from a center to an outer peripheral end of the substrate in a horizontal direction while downwardly discharging the replacement liquid. Thereafter, the substrate is dried. During this drying, the nozzle device is lowered from a position above the center of the substrate to a nozzle lower position close to the substrate while gas is downwardly injected from the nozzle device. Further, the nozzle device is moved in a horizontal direction from the center to the outer peripheral end of the substrate while injection of gas is continued.


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