The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Mar. 10, 2022
Kioxia Corporation, Tokyo, JP;
Keiichi Niwa, Yokkaichi Mie, JP;
Yoshiaki Goto, Kiyosu Aichi, JP;
Kioxia Corporation, Tokyo, JP;
Abstract
A semiconductor device includes: a substrate on which wiring is formed; a first semiconductor element flip-chip bonded to the substrate; a second semiconductor element provided on the first semiconductor element; a first resin provided in at least part of a region between the first semiconductor element and the substrate; a second resin provided in at least part of a region between the second semiconductor element and the substrate; and a member having a thermal conductivity higher than a thermal conductivity of the first resin and a thermal conductivity of the second resin, provided between the first resin and the second resin, having a part overlapping with an upper surface of the first semiconductor element, and having another part overlapping with a first wiring part as part of the wiring in a top view.