The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Sep. 15, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Nicholas Anthony Lanzillo, Wynantskill, NY (US);

David Wolpert, Poughkeepsie, NY (US);

Lawrence A. Clevenger, Saratoga Springs, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/42 (2026.01); H10W 20/20 (2026.01); H10W 20/41 (2026.01);
U.S. Cl.
CPC ...
H10W 20/427 (2026.01); H10W 20/20 (2026.01); H10W 20/42 (2026.01);
Abstract

Embodiments include super via placement in the development of an integrated circuit. Aspects of the invention include obtaining a power distribution network for the integrated circuit (IC) IC, wherein the PDN includes a plurality of metal vias each configured to connect adjacent metal layers of a plurality of metal layers. Aspects also include placing one or more cells on each metal layer of the IC and identifying a power demand associated with each of the one or more cells. Aspects further include updating the PDN, based on the power demand associated with each of the one or more cells, to replace at least two of the plurality of metal vias with a super via that is configured to connect non-adjacent metal layers of the plurality of metal layers.


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