The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Sep. 15, 2021
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Tomoyuki Shinohara, Kyoto, JP;

Yoshifumi Okada, Kyoto, JP;

Nobuaki Okita, Kyoto, JP;

Hiroshi Kato, Kyoto, JP;

Takashi Shinohara, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 72/76 (2026.01); H10P 72/00 (2026.01); B08B 1/12 (2024.01); B08B 1/20 (2024.01);
U.S. Cl.
CPC ...
H10P 72/7618 (2026.01); H10P 72/0414 (2026.01); B08B 1/12 (2024.01); B08B 1/20 (2024.01);
Abstract

A first substrate holder holds an outer peripheral end of a substrate. A second substrate holder holds a lower-surface center region of the substrate by suction at a position farther downward than the first substrate holder. The second substrate holder and the lower-surface brush are provided on a mobile base that is movable in a horizontal direction. The mobile base is moved between a position at which the lower-surface brush is opposite to a lower-surface outer region of the substrate and a position at which the lower-surface brush is opposite to the lower-surface center region of the substrate. The lower-surface center region of the substrate held by the first substrate holder is cleaned. At this time, a height position of the substrate is higher than an upper end portion of a processing cup. The lower-surface outer region of the substrate held by the second substrate holder is cleaned. At this time, a height position of the substrate is lower than the upper end portion of the processing cup.


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