The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Jan. 31, 2023
Applicant:

Sumco Corporation, Tokyo, JP;

Inventor:

Naoyuki Wada, Arita-cho, JP;

Assignee:

SUMCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/20 (2006.01); C30B 29/06 (2006.01); H10D 62/10 (2025.01); H10D 62/40 (2025.01); H10P 14/20 (2026.01); H10P 14/24 (2026.01);
U.S. Cl.
CPC ...
H10P 14/24 (2026.01); C30B 25/20 (2013.01); C30B 29/06 (2013.01); H10D 62/117 (2025.01); H10D 62/405 (2025.01); H10P 14/2905 (2026.01); H10P 14/2926 (2026.01); H10P 14/3411 (2026.01); H10P 14/3444 (2026.01);
Abstract

An epitaxial wafer includes a silicon substrate having a top surface and an epitaxial layer on said top surface, wherein the epitaxial layer has a thickness in a range of 0.3 μm to 1.0 μm, and a thickness variation of 1% or less. A method of preparing such epitaxial wafer includes placing a silicon substrate on a susceptor in an epitaxial reactor; rotating the susceptor at a rotation rate (D); and applying a source gas in the epitaxial reactor to grow an epitaxial layer of a desired thickness (B) at a growth rate (A) on the silicon substrate; wherein the source gas is applied for a growth time (C) that satisfies C=B/A and the rotation rate (D) is selected from a range of 22 to 70 rpm that allows the susceptor to rotate to an exact integer number of turns (E) based on a relationship D=E/C.


Find Patent Forward Citations

Wada, Naoyuki. (2026). Flat epitaxial wafer having minimal thickness variation (U.S. Patent No. 12635427). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12635427

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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